Icheon, South Korea

Jae Joon Ahn


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Icheon-si, KR (2014)
  • Icheon, KR (2016)

Company Filing History:


Years Active: 2014-2016

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2 patents (USPTO):Explore Patents

Title: Innovations by Jae Joon Ahn

Introduction

Jae Joon Ahn is a notable inventor based in Icheon, South Korea. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to semiconductor packaging.

Latest Patents

One of his latest patents is for semiconductor packages with optical transceivers. This invention includes a package substrate, a first semiconductor substrate, and a second semiconductor substrate stacked on the package substrate. It features an optical transceiver that generates and receives an optical signal traveling between the package substrate and the second semiconductor substrate using an infrared (IR) ray that passes through the first semiconductor substrate. Another patent focuses on a semiconductor package for selecting semiconductor chips from a chip stack. This package includes first, second, third, and fourth semiconductor chips stacked with an arrangement of chip selection vias. A connection unit is provided between the second and third semiconductor chips, allowing for selective connection and disconnection of some chip selection vias.

Career Highlights

Jae Joon Ahn is currently employed at SK Hynix Inc., a leading company in the semiconductor industry. His work has contributed to advancements in semiconductor packaging, enhancing the efficiency and functionality of electronic devices.

Collaborations

He has collaborated with notable coworkers, including In Chul Hwang and Il Hwan Cho, who have also contributed to the field of semiconductor technology.

Conclusion

Jae Joon Ahn's innovative patents and contributions to semiconductor technology highlight his role as a significant inventor in the industry. His work continues to influence advancements in electronic devices and semiconductor packaging.

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