Skhynix Inc.

Jae Joon Ahn

Ki Young Kim

Tae Yong Lee

Ki Bum Kim

In Chul Hwang

Bok Gyu Min

Il Hwan Cho

Chong Ho Cho

Da Un Nah

Kyoung Mo Yang

Joon Ki Hong

A semiconductor package includes a package substrate, a first semiconductor substrate and a second semiconductor substrate stacked on the package substrate, and an optical transceiver that generates and receives an optical signal travelling between the package substrate and the second semiconductor substrate using an infrared (IR) ray that passes through the first semiconductor substrate.

Semiconductor packages with optical transceivers

A semiconductor package includes: first, second, third and fourth semiconductor chips stacked while having the arrangement of chip selection vias; and a connection unit provided between a second semiconductor chip and a third semiconductor chip, and configured to mutually connect some of the chip selection vias of the second and third semiconductor chips and disconnect the others of the chip selection vias of the second and third semiconductor chips, wherein the first and second semiconductor chips and the third and fourth semiconductor chips are stacked in a flip chip type.

Semiconductor package for selecting semiconductor chip from a chip stack

Growing community of inventors

Icheon, South Korea

Jae Joon Ahn