The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
Mar. 15, 2023
Applicant:
SK Hynix Inc., Icheon-si, KR;
Inventors:
Bok Gyu Min, Icheon-si, KR;
Beom Sang Cho, Icheon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 25/0657 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/5448 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01);
Abstract
A substrate includes: a first die alignment mark and a first die position mark defining a die stack region. The first die alignment mark has substantially a cross shape having substantially a vertical bar and substantially a horizontal bar intersecting each other substantially perpendicularly, and the first die position mark includes a first main position mark having a first area and a first branch position mark having a second area different from the first area.
Min, Bok. (2026). Substrate having a die position mark and a semiconductor die stack structure including semiconductor dies stacked on the substrate (U.S. Patent No. 12581961). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12581961
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile