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For the Inventor, By the Inventor

Portland, OR, United States of America

Blake C Lin

USPTO Granted Patents = 12 

 

Average Co-Inventor Count = 7.3

ph-index = 3

Forward Citations = 17(Granted Patents)


Company Filing History:

goldMedal12 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2016-2024

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12 patents (USPTO):Explore Patents
1. 12176284 - Through plate interconnect for a vertical MIM capacitor (2024-12-24),
2. 12080643 - Integrated circuit structures having differentiated interconnect lines in a same dielectric layer (2024-09-03),
3. 11758711 - Thin-film transistor embedded dynamic random-access memory with shallow bitline (2023-09-12),
4. 11404536 - Thin-film transistor structures with gas spacer (2022-08-02),
5. 11329047 - Thin-film transistor embedded dynamic random-access memory with shallow bitline (2022-05-10),
6. 11121073 - Through plate interconnect for a vertical MIM capacitor (2021-09-14),
7. 11024356 - Apparatus for low power write and read operations for resistive memory (2021-06-01),
8. 10438640 - Apparatus for low power write and read operations for resistive memory (2019-10-08),
9. 10068628 - Apparatus for low power write and read operations for resistive memory (2018-09-04),
10. 9865322 - Low resistance bitline and sourceline apparatus for improving read and write operations of a nonvolatile memory (2018-01-09),
11. 9478273 - Low resistance bitline and sourceline apparatus for improving read and write operations of a nonvolatile memory (2016-10-25),
12. 9286976 - Apparatuses and methods for detecting write completion for resistive memory (2016-03-15),

Title: Innovations of Inventor Blake C Lin

Introduction

Blake C Lin is a notable inventor based in Portland, OR, who has made significant contributions to the field of integrated circuits. With a total of 12 patents under his name, Lin exemplifies the spirit of innovation, focusing on enhancing interconnect structures in microelectronics.

Latest Patents

Among his latest patents, one titled "Through plate interconnect for a vertical MIM capacitor" discloses an advanced interconnect structure. This invention features a first metal interconnect within a bottom dielectric layer, and a unique via that extends through multiple dielectric layers to connect with an MIM capacitor. This innovation not only enhances the interconnection process but also aims to improve the overall performance of electronic devices.

Another patent, "Integrated circuit structures having differentiated interconnect lines in a same dielectric layer," describes a method for fabricating integrated circuit structures. This patent introduces an inter-layer dielectric layer above a substrate, containing a plurality of conductive interconnect lines with varying heights. This innovation allows for more efficient space usage in integrated circuits by facilitating differentiated interconnects within the same dielectric layer.

Career Highlights

Currently, Blake C Lin is associated with Intel Corporation, where he continues to drive innovation in semiconductor technologies. His extensive experience and vast knowledge contribute significantly to the development of cutting-edge products that propel the electronics industry forward.

Collaborations

Throughout his career, Lin has worked alongside talented colleagues, including Yih Wang and Cyrille Dray. This collaborative environment fosters creativity and allows for the exchange of ideas, further enhancing the innovative processes within their projects.

Conclusion

Blake C Lin's contributions as an inventor, particularly in the realm of integrated circuits, highlight the importance of continuous innovation in technology. With a solid foundation of patents and a collaborative network, Lin is poised to further impact the electronics industry, advancing not only his career but also the field as a whole.

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