The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Apr. 18, 2018
Intel Corporation, Santa Clara, CA (US);
Yih Wang, Portland, OR (US);
Abhishek A. Sharma, Hillsboro, OR (US);
Tahir Ghani, Portland, OR (US);
Allen B. Gardiner, Portland, OR (US);
Travis W. Lajoie, Forest Grove, OR (US);
Pei-hua Wang, Beaverton, OR (US);
Chieh-jen Ku, Hillsboro, OR (US);
Bernhard Sell, Portland, OR (US);
Juan G. Alzate-Vinasco, Tigard, OR (US);
Blake C. Lin, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Described herein are embedded dynamic random-access memory (eDRAM) memory cells and arrays, as well as corresponding methods and devices. An exemplary eDRAM memory array implements a memory cell that uses a thin-film transistor (TFT) as a selector transistor. One source/drain (S/D) electrode of the TFT is coupled to a capacitor for storing a memory state of the cell, while the other S/D electrode is coupled to a bitline. The bitline may be a shallow bitline in that a thickness of the bitline may be smaller than a thickness of one or more metal interconnects provided in the same metal layer as the bitline but used for providing electrical connectivity for components outside of the memory array. Such a bitline may be formed in a separate process than said one or more metal interconnects. In an embodiment, the memory cells may be formed in a back end of line process.