Pleasanton, CA, United States of America

Ankur Aggarwal

This inventor holds 32 USPTO granted patents and 19 published patent applications, primarily in Optical Packaging. Top assignees: Celestial Ai Inc., Sicily Merger Sub II, Inc.. Active years: 2023-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ankur Aggarwal. Retrieved from https://idiyas.com/inventor/ankur-aggarwal-xm71km9n

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 32 

% Patents Active = 78.1

Average Co-Inventor Count = 3.0

ph-index = 6

Forward Citations = 132(Granted Patents)


Company Filing History:


Years Active: 2023-2026

Loading Chart...
Areas of Expertise:
Optical Multi-Chip Interconnect
Photonic Integrated Circuit
Wafer Package
Electrical Bridge Package
Optically Bridged Assembly
High Bandwidth Memory
Temperature Range Packaging
Circuit Package
Embedded Photonics
Multi-Die Interconnect
Optical Components
Co-Packaged Optics
32 patents (USPTO):Explore Patents

Title: Ankur Aggarwal: Innovator in Photonic Integrated Circuits

Introduction

Ankur Aggarwal is a prominent inventor based in Pleasanton, California. He has made significant contributions to the field of photonic integrated circuits, holding a total of 19 patents. His work focuses on advancing technology that enhances the performance and efficiency of electronic and photonic systems.

Latest Patents

One of Ankur Aggarwal's latest patents is for an optically bridged multicomponent package with an extended temperature range. This innovative package includes a photonic integrated circuit (PIC) with a modulator that has a first modulator input. The design features a PIC interconnect region located within two millimeters or fifty microns from the modulator. Additionally, it incorporates an electric integrated circuit (EIC) with a driver circuit and an EIC interconnect region, also within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input through the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator is designed to receive a temperature-dependent bias voltage, which inversely matches the temperature dependence of the modulator across an extended temperature range.

Career Highlights

Ankur Aggarwal has established himself as a key figure in the technology sector, particularly through his work at Celestial AI Inc. His expertise in photonic integrated circuits has positioned him as a leader in innovation within the industry.

Collaborations

Ankur has collaborated with notable colleagues, including Subal Sahni and Philip Winterbottom, contributing to various projects that push the boundaries of technology.

Conclusion

Ankur Aggarwal's contributions to the field of photonic integrated circuits exemplify his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in modern electronic systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…