For the Inventor, By the Inventor

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Santa Clara, CA, United States of America

Celestial Ai Inc.

USPTO Granted Patents = 48

EPO Patents = 1

Forward Citations = 242

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25 inventors (with patents filed for the assignee):

Ankur Aggarwal (28 out of 32 patents)

Philip Winterbottom (27 out of 41 patents)

Martinus Bos (25 out of 32 patents)

4. Subal Sahni (24 out of 74 patents)

5. David E Lazovsky (20 out of 59 patents)

6. Nikolaos Pleros (6 out of 7 patents)

7. Apostolos Tsakyridis (6 out of 6 patents)

8. Suresh Venkata Pothukuchi (5 out of 6 patents)

9. Anmol Rathi (5 out of 5 patents)

10. Matteo Staffaroni (4 out of 17 patents)

11. Angelina Totovic (4 out of 4 patents)

12. Saurabh Vats (4 out of 5 patents)

13. Ismail Hakki Ozguc (4 out of 5 patents)

14. Kevin Park (4 out of 5 patents)

15. George Giamougiannis (3 out of 3 patents)

Core Competencies:

Photonic Computing

Electro-Photonic Network

Optical Interconnect

Multi-Chip Network

Photonic Memory Fabric

Neuromorphic Photonics

Optical Packaging

High Bandwidth Memory

Thermal Control

Coherent Architectures

Electrical Interconnects

Tensor Engine

48 patents: Sort by Forward Citations

1. 12706680 - Multi-chip electro-photonic network (2026-08-11),

2. 12690438 - Via formed in a wafer using a front-side and a back-side process (2026-07-21),

3. 12650563 - Packaging optical components in a circuit package (2026-06-09),

4. 12615087 - Coherent photonic computing architectures (2026-04-28),

5. 12571971 - Converting processing dimensions of a wafer package (2026-03-10),

6. 12568809 - Via formed using a partial plug that stops before a substrate (2026-03-03),

7. 12566551 - Multi-chip electro-photonic networks and photonic memory fabrics for interconnecting multiple circuit packages (2026-03-03),

8. 12566305 - Preserving access to edge coupling components on a wafer package (2026-03-03),

9. 12564047 - Thermal control of an optical component (2026-02-24),

10. 12561059 - Multi-chip electro-photonic networks and photonic memory fabrics for interconnecting multiple circuit packages (2026-02-24),

11. 12525595 - Electrical bridge package with integrated off-bridge photonic channel interface (2026-01-13),

12. 12494403 - Preserving access to optical components on a wafer package with sacrificial die (2025-12-09),

13. 12493155 - Preserving access to optical components on a wafer package with sacrificial cap (2025-12-09),

14. 12468103 - Optically bridged multicomponent package with extended temperature range (2025-11-11),

15. 12443000 - Optically bridged multicomponent package with extended temperature range (2025-10-14),

Company Overview

Celestial Ai Inc. is a technology company based in Santa Clara, California, specializing in advanced artificial intelligence solutions. The organization focuses on developing innovative hardware and software systems that enhance computational efficiency and performance, particularly in the fields of machine learning and data processing. By leveraging cutting-edge technologies, Celestial Ai aims to transform how industries utilize AI, driving advancements in various applications ranging from cloud computing to autonomous systems.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

48 Patents

#75 in Santa Clara, CA

#1,715 in California

#7,288 in US

#14,561 in the World

Santa Clara, CA, United States of America

Celestial Ai Inc.

Forward Citations = 242

25 inventors:

Ankur Aggarwal (28 out of 32 patents)

Philip Winterbottom (27 out of 41 patents)

Martinus Bos (25 out of 32 patents)

4. Subal Sahni (24 out of 74 patents)

5. David E Lazovsky (20 out of 59 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Celestial Ai Inc.. Retrieved from https://idiyas.com/company/celestial-ai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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