The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2026

Filed:

Dec. 06, 2022
Applicant:

Celestial Ai Inc., Santa Clara, CA (US);

Inventors:

Ankur Aggarwal, Pleasanton, CA (US);

Jeremy Matthew Plunkett, San Jose, CA (US);

Assignee:

Celestial AI Inc., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 21/76805 (2013.01); H01L 21/76831 (2013.01); H01L 21/76877 (2013.01); H01L 21/76895 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/5226 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/02313 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05018 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05559 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/13021 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01);
Abstract

A method is described. The method includes creating a partial through-substrate via (TSV) plug in a front side of a wafer, the partial TSV having a front side and a back side. The back side of the partial TSV extending toward a front side of a substrate but not into a bulk of the substrate. A cavity is etched in a back side of the wafer that exposes the partial TSV plug. An insulator is applied to the etched back side of the wafer. A portion of the partial TSV plug is exposed by removing a portion of the insulator. A conductive material is deposited to connect the exposed, partial TSV plug to a surface on the back side of the wafer.


Find Patent Forward Citations

Aggarwal, Ankur. (2026). Via formed using a partial plug that stops before a substrate (U.S. Patent No. 12568809). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12568809

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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