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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12561059 B1

PDFFull Text
Date of Patent:
Feb. 24, 2026

Filed:

Apr. 03, 2025

Multi-chip electro-photonic networks and photonic memory fabrics for interconnecting multiple circuit packages

Applicant:

Celestial Ai Inc., Santa Clara, CA (US);

Inventors:

David Lazovsky, Los Gatos, CA (US);

Philip Winterbottom, San Jose, CA (US);

Martinus Bos, San Jose, CA (US);

Assignee:

Celestial AI Inc., Santa Clara, CA (US);

Attorney:

Fish & Richardson P.C.

Primary Examiner:

Nathan M Cors

Int. Cl.
CPC ...
G06F 3/06 (2006.01); G02B 6/12 (2006.01); G02B 6/122 (2006.01); G02B 6/42 (2006.01); H04B 10/80 (2013.01); H04Q 11/00 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0611 (2013.01); G02B 6/12019 (2013.01); G02B 6/1225 (2013.01); G02B 6/4246 (2013.01); G06F 3/0655 (2013.01); G06F 3/0679 (2013.01); H04B 10/801 (2013.01); H04Q 11/0062 (2013.01);
Abstract

Multi-chip electro-photonic networks for interconnecting multiple circuit packages via photonic channels. Examples of a computing system include a first circuit package, a second circuit package, and one or more inter-chip bidirectional photonic channels interconnecting the first and second circuit packages. The first circuit package can include one or more memory nodes. The second circuit package can include multiple compute nodes and intra-chip bidirectional photonic channels interconnecting the compute nodes.

Find Patent Forward Citations

Lazovsky, David. (2026). Multi-chip electro-photonic networks and photonic memory fabrics for interconnecting multiple circuit packages (U.S. Patent No. 12561059). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12561059

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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