The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Apr. 01, 2025
Applicant:

Celestial Ai Inc., Santa Clara, CA (US);

Inventors:

Ankur Aggarwal, Pleasanton, CA (US);

Anmol Rathi, San Jose, CA (US);

Suresh Venkata Pothukuchi, Chandler, AZ (US);

Assignee:

Celestial Al Inc., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/12 (2006.01); G02B 6/13 (2006.01); G02B 6/43 (2006.01); H10B 80/00 (2026.01); H10D 80/30 (2026.01); H10F 55/00 (2025.01); H10W 20/20 (2026.01); H10W 70/60 (2026.01); H10W 70/63 (2026.01); H10W 70/65 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H10W 72/90 (2026.01);
U.S. Cl.
CPC ...
G02B 6/4239 (2013.01); G02B 6/12004 (2013.01); G02B 6/13 (2013.01); G02B 6/42 (2013.01); G02B 6/4215 (2013.01); G02B 6/4228 (2013.01); G02B 6/4243 (2013.01); G02B 6/4246 (2013.01); G02B 6/4249 (2013.01); G02B 6/4251 (2013.01); G02B 6/4255 (2013.01); G02B 6/4256 (2013.01); G02B 6/4259 (2013.01); G02B 6/4274 (2013.01); G02B 6/4278 (2013.01); G02B 6/428 (2013.01); G02B 6/4292 (2013.01); G02B 6/4293 (2013.01); G02B 6/4295 (2013.01); G02B 6/43 (2013.01); H10B 80/00 (2023.02); H10D 80/30 (2025.01); H10F 55/00 (2025.01); H10W 20/20 (2026.01); H10W 70/611 (2026.01); H10W 70/635 (2026.01); H10W 70/65 (2026.01); H10W 74/111 (2026.01); H10W 74/117 (2026.01); H10W 74/124 (2026.01); H10W 90/00 (2026.01); H10W 90/701 (2026.01); H10W 72/90 (2026.01); H10W 90/734 (2026.01);
Abstract

The present disclosure relates to example implementations of optically accessible circuit packages. For example, this disclosure includes implementations for creating a circuit package with a photonic integrated circuit (PIC) connected to electrical integrated circuit (EIC) components via an organic interposer. In many implementations, the circuit package maintains optical access to a gating coupler (GC) region on the PIC via an internal cavity area in the organic interposer. In this way, a fiber array unit (FAU) or other optical connection can couple to the circuit package to communicate data from the EIC components of the circuit package and another circuit package or an external device connected to the FAU (e.g., both send and receive data with the cp) via the open access GC region.


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