Dallas, TX, United States of America

Andrew Arthur Ketterson

USPTO Granted Patents = 16 

Average Co-Inventor Count = 2.6

ph-index = 3

Forward Citations = 23(Granted Patents)


Company Filing History:


Years Active: 2006-2024

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16 patents (USPTO):Explore Patents

Title: **Andrew Arthur Ketterson: A Pioneer in Integrated Circuit Innovations**

Introduction

Andrew Arthur Ketterson is an accomplished inventor based in Dallas, TX, recognized for his significant contributions to the field of integrated circuits and microwave technology. With a remarkable portfolio of 16 patents, Ketterson has demonstrated a profound understanding of innovative packaging solutions for electronic components.

Latest Patents

Ketterson's latest patents showcase his expertise in enhancing integrated circuit (IC) packaging. One notable patent is the "Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)." This innovative design integrates a heat spreader within a dielectric layer of an RDL, effectively facilitating high-density IC packaging. This is particularly beneficial for applications involving monolithic microwave integrated circuits (MMICs) as it significantly improves heat removal, maintaining the performance of radio frequency (RF) circuits through millimeter wave frequencies in a compact and economical package.

Another recent patent is for a "Monolithic microwave integrated circuit (MMIC) with embedded transmission line (ETL) ground shielding." This design features a substrate with an active side covered by an ETL dielectric layer, topped with a ground plane that shields against electromagnetic coupling. This enhancement not only improves thermal dissipation but also optimizes the performance of internal transmission lines, thereby advancing the functionality of microwave circuit designs.

Career Highlights

Throughout his career, Ketterson has worked with leading companies in the semiconductor industry, including Qorvo US, Inc. and Triquint Semiconductor Corporation. His role in these organizations has allowed him to influence the development of cutting-edge technologies in the field of electronic components, especially those involving microwave and RF systems.

Collaborations

Ketterson has collaborated with established professionals in his field, including Christo Pavel Bojkov and Yongjie Cui. These partnerships have not only enriched his work but have also contributed to his reputation as a trailblazer in innovative circuit design.

Conclusion

Andrew Arthur Ketterson stands out as a key figure in the domain of integrated circuits, making significant strides in patentable innovations. His latest patents reflect a deep commitment to advancing technology and improving circuit performance, thereby shaping the future of electronic applications. Through his expertise and collaborations, Ketterson continues to push the boundaries of what is possible in the world of semiconductor technology.

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