Anand N Iyer

Title: Innovations of Anand N Iyer

Introduction

Anand N Iyer is a prominent inventor based in Santa Clara, CA. He has made significant contributions to the field of technology, holding a total of 12 patents. His work primarily focuses on methods and systems that enhance the efficiency of various processes in the semiconductor industry.

Latest Patents

One of his latest patents is titled "Ru liner above a barrier layer." This patent describes a method to produce a layered substrate, which includes the steps of depositing a diffusion barrier layer on the substrate, depositing an underlayer comprising a Group 6 metal on the barrier layer, and depositing a ruthenium layer on the underlayer. This innovative approach results in a highly effective layered substrate. Another notable patent is the "Spray system for slurry reduction during chemical mechanical polishing (CMP)." This patent outlines methods and apparatuses for dispensing polishing fluids onto a polishing pad within a CMP system. The method includes urging a substrate against the surface of a pad using a carrier assembly while dispensing fluid at a variable flow rate, enhancing the polishing process.

Career Highlights

Anand N Iyer has worked with several leading companies in the technology sector, including Applied Materials, Inc. and Cisco Technology, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in the industry.

Collaborations

Throughout his career, Anand has collaborated with notable professionals such as Erik S Rondum and Gregory E Menk. These collaborations have further enriched his work and led to the development of groundbreaking technologies.

Conclusion

Anand N Iyer's contributions to the field of technology through his patents and collaborations highlight his innovative spirit and dedication to advancing the semiconductor industry. His work continues to influence the development of new technologies and processes.