The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2004
Filed:
Jul. 12, 2002
Benjamin A. Bonner, Campbell, CA (US);
Anand N. Iyer, Santa Clara, CA (US);
Deepak N. Kumar, Sunnyvale, CA (US);
Thomas H. Osterheld, Mountain View, CA (US);
Wei-Yung Hsu, Santa Clara, CA (US);
Yong-Sik R. Kim, Santa Clara, CA (US);
Christopher W. Smith, Los Altos Hills, CA (US);
Huanbo Zhang, Cupertino, CA (US);
Applied Materials Inc., Santa Clara, CA (US);
Abstract
Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate including positioning a substrate comprising at least first dielectric material and second dielectric material disposed thereon in a polishing apparatus, polishing the substrate with a first polishing composition having a first selectivity, and polishing the substrate with a second polishing composition having a second selectivity greater than the first selectivity.