The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
Jun. 25, 2021
Applied Materials, Inc., Santa Clara, CA (US);
Chih Chung Chou, San Jose, CA (US);
Anand Nilakantan Iyer, Cupertino, CA (US);
Ekaterina Mikhaylichenko, San Jose, CA (US);
Christopher Heung-Gyun Lee, San Jose, CA (US);
Erik Rondum, San Ramon, CA (US);
Tiffany Yu-Nung Cheung, Alameda, CA (US);
Shou-Sung Chang, Mountain View, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP polishing method including urging a substrate against a surface of a pad of a polishing system using a carrier assembly. A fluid is dispensed onto the pad from a fluid delivery assembly at a variable flow rate and a first flow rate of the variable flow rate is pulsed at a frequency and a duty cycle. The frequency refers to a number of pulses of the fluid at the first flow rate per rotation of the pad. The term duty cycle refers to a percentage of the pad exposed to fluid per rotation of the pad. The carrier assembly is translated across a surface of the pad while rotating the carrier assembly about a rotational axis.