Applied Materials, Inc.

Cisco Technology, Inc.

Anand N Iyer

Erik S Rondum

Gopalakrishna B Prabhu

Gregory E Menk

Garlen C Leung

Peter McReynolds

Benjamin A Bonner

Christopher Heung-Gyun Lee

Huanbo Zhang

Jeonghoon Oh

Andrew J Nagengast

Robert L Jackson

Jie Diao

Thomas Li

Wei-Cheng Lee

Steven M Zuniga

Thomas H Osterheld

Shou-Sung Chang

Wei-Yung Hsu

Jianxin Lei

Sung-Kwan Kang

Shankar Natarajan

Chih Chung Chou

Ekaterina A Mikhaylichenko

Wenting Hou

Christopher W Smith

Deepak N Kumar

Henry H Au

Ghunbong Cheung

Tiffany Yu-Nung Cheung

Zhaoxuan Wang

Venkat Kankipati

Srinivasan Nariangadu

Yong-Sik R Kim

Hyuen Karen Tran

A method to produce a layered substrate, which includes the steps of depositing a diffusion barrier layer on the substrate; depositing an underlayer comprising a Group 6 metal on the barrier layer; and depositing a ruthenium layer comprising ruthenium on the underlayer, to produce the layered substrate. A layered substrate is also disclosed.

Ru liner above a barrier layer

Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP polishing method including urging a substrate against a surface of a pad of a polishing system using a carrier assembly. A fluid is dispensed onto the pad from a fluid delivery assembly at a variable flow rate and a first flow rate of the variable flow rate is pulsed at a frequency and a duty cycle. The frequency refers to a number of pulses of the fluid at the first flow rate per rotation of the pad. The term duty cycle refers to a percentage of the pad exposed to fluid per rotation of the pad. The carrier assembly is translated across a surface of the pad while rotating the carrier assembly about a rotational axis.

Spray system for slurry reduction during chemical mechanical polishing (cmp)

Embodiments herein generally relate to chemical mechanical polishing (CMP) systems and methods for reducing non-uniform material removal rate at or near the peripheral edge of a substrate when compared to radially inward regions therefrom. In one embodiment, a polishing system includes a substrate carrier comprising an annular retaining ring which is used to surround a to-be-processed substrate during a polishing process and a polishing platen. The polishing platen includes cylindrical metal body having a pad-mounting surface. The pad-mounting surface comprises a plurality of polishing zones which include a first zone having a circular or annular shape, a second zone circumscribing the first zone, and a third zone circumscribing the second zone. A surface of the second zone is recessed from surfaces of the first and third zones adjacent thereto, and a width of the second zone is less than an outer diameter of the annular retaining ring.

Platen surface modification and high-performance pad conditioning to improve CMP performance

A retaining ring includes a generally annular body having an inner surface to constrain a substrate, an outer surface, and a bottom surface. The bottom surface has a plurality of channels extending from the outer surface to the inner surface and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad. Each channel includes a recessed region adjacent the outer surface such that the channel is deeper in the recessed region than in a remainder of the channel. The recessed region and the remainder of the channel each have substantially uniform depth.

Retaining ring for CMP

A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.

A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis.

Polishing article with integrated window stripe

A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.

Polishing apparatus with grooved subpad

A method is described. The method includes contacting a non-solid material to a non-linear edge of a sheet of polishing material, and causing the non-solid material to solidify to form a window that contacts the non-linear edge of the polishing material.

A method and apparatus for processing a network operating system operation is provided. A network management application that configures and monitors network components transmits a payload containing an XML document to a transport agent. The XML document contains one or more network device operating system operations and associated data. The XML document and associated data is read from the payload and transmitted to a programmatic agent. The programmatic agent parses the XML document containing the operation and associated data, and provides the operation and associated data in a callback to an appropriate network component. The network component processes the operation, and transmits responsive data to the programmatic agent. The programmatic agent creates a responsive XML document containing the responsive data, and transmits the responsive XML document to the network management application. Network management applications may both configure and monitor network device operating system components using operations within the XML document.

Programmatic interface to network device operating system

A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.

Materials for chemical mechanical polishing

Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate including positioning a substrate comprising at least first dielectric material and second dielectric material disposed thereon in a polishing apparatus, polishing the substrate with a first polishing composition having a first selectivity, and polishing the substrate with a second polishing composition having a second selectivity greater than the first selectivity.

Methods and compositions for chemical mechanical polishing shallow trench isolation substrates

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Santa Clara, CA, United States of America

Anand N Iyer