Munich, Germany

Alois Stelzl

This inventor holds 37 USPTO granted patents and 1 published patent application and 3 EPO patents, primarily in MEMS Technology. Top assignees: Epcos Ag, Siemens Aktiengesellschaft, Snaptrack Incorporated. Active years: 2000-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alois Stelzl. Retrieved from https://idiyas.com/inventor/alois-stelzl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 37 

% Patents Active = 70.3

 

Average Co-Inventor Count = 3.5

ph-index = 13

Forward Citations = 469(Granted Patents)


Location History:

  • Munchen, DE (2000)
  • München, DE (2001 - 2015)
  • Munich, DE (2004 - 2022)

Company Filing History:


Years Active: 2000-2022

Loading Chart...
Loading Chart...
Areas of Expertise:
MEMS Components
Encapsulation Methods
Wafer-Level Packaging
Surface Acoustic Waves
Electronic Components
Chip Devices
Production Methods
Electrical Components
Microphones
Hermetic Sealing
37 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Alois Stelzl in Munich

Introduction: Alois Stelzl, an accomplished inventor based in Munich, Germany, holds an impressive portfolio of 37 patents. His groundbreaking work primarily centers around electric components and Micro-Electro-Mechanical Systems (MEMS), reflecting his dedication to advancing technology in this field.

Latest Patents: Among his latest innovations, Alois Stelzl has developed an "Electric component with sensitive component structures" which relates to a simple yet effective method for producing electric components for chips with sensitive component structures. This invention features a connection structure and a switching structure located on the underside of the chip, supported by a substrate that includes at least one polymer layer.

Additionally, his patent for a "MEMS component and method for encapsulating MEMS components" showcases a sophisticated design that includes component structures on a substrate. This design also consists of contact areas that connect to the component structures, metallic column structures, and metallic frame structures, all working in unison with a cured resist layer to encapsulate the MEMS components efficiently.

Career Highlights: Alois Stelzl has had a significant impact on the technology sphere through his previous positions in renowned companies such as Epcos AG and Siemens Aktiengesellschaft. His expertise and innovations have been pivotal in the growth of electric and MEMS components.

Collaborations: Throughout his career, Alois has collaborated with notable colleagues like Hans Krueger and Wolfgang Pahl. These partnerships have further enriched his work, allowing for the exchange of ideas and fostering an environment of innovation and creativity.

Conclusion: Alois Stelzl's contributions to the fields of electric components and MEMS highlight his status as a leading inventor in Munich. With a robust portfolio of patents and a career enriched by collaborations and professional experiences, he continues to pave the way for future advancements in technology. His work not only exemplifies innovation but also enhances the efficiency and capabilities of modern technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…