The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Mar. 28, 2012
Applicants:

Christian Bauer, Munich, DE;

Hans Krueger, Munich, DE;

Juergen Portmann, Munich, DE;

Alois Stelzl, Munich, DE;

Wolfgang Pahl, Munich, DE;

Robert Koch, Munich, DE;

Inventors:

Christian Bauer, Munich, DE;

Hans Krueger, Munich, DE;

Juergen Portmann, Munich, DE;

Alois Stelzl, Munich, DE;

Wolfgang Pahl, Munich, DE;

Robert Koch, Munich, DE;

Assignee:

SNAPTRACK, INC., San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); B81C 1/00 (2006.01); H03H 9/10 (2006.01); H01L 41/25 (2013.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 41/053 (2013.01); B81C 1/00301 (2013.01); H01L 24/11 (2013.01); H01L 41/25 (2013.01); H03H 9/1071 (2013.01); B81B 2207/095 (2013.01); H01L 2224/1134 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1461 (2013.01); Y10T 29/42 (2015.01);
Abstract

A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.


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