The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2015
Filed:
Nov. 18, 2011
Applicants:
Christian Bauer, München, DE;
Hans Krüger, München, DE;
Jürgen Portmann, München, DE;
Alois Stelzl, München, DE;
Inventors:
Christian Bauer, München, DE;
Hans Krüger, München, DE;
Jürgen Portmann, München, DE;
Alois Stelzl, München, DE;
Assignee:
EPCOS AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); B81B 7/00 (2006.01); H03H 3/02 (2006.01); H03H 9/10 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01); B81C 1/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0064 (2013.01); H01L 23/3121 (2013.01); H03H 3/02 (2013.01); H03H 9/10 (2013.01); H01L 23/29 (2013.01); H01L 23/3142 (2013.01); H01L 21/561 (2013.01); H01L 23/552 (2013.01); H01L 2224/16225 (2013.01); H01L 25/0655 (2013.01); B81C 1/00333 (2013.01); H01L 2924/1461 (2013.01);
Abstract
The invention relates to a component and a method for producing said component. The component comprises a substrate (S), a chip (CH), a frame (MF), which is connected to the substrate (S) and on which the chip (CH) bears. A metallic closure layer (ML) encompasses the frame (MF), the substrate (S) and the chip (CH) such that a volume enclosed by the substrate (S), the chip (CH) and the frame (MF) is hermetically sealed.