The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2022
Filed:
Oct. 19, 2015
Applicant:
Snaptrack, Inc., San Diego, CA (US);
Inventors:
Christian Bauer, Munich, DE;
Hans Krüger, Munich, DE;
Jürgen Portmann, Munich, DE;
Alois Stelzl, Munich, DE;
Wolfgang Pahl, Munich, DE;
Assignee:
Snaptrack, Inc., San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H04R 1/22 (2006.01); H04R 19/00 (2006.01); H04R 31/00 (2006.01); H01L 23/00 (2006.01); H04R 19/04 (2006.01); B81C 1/00 (2006.01); B81B 7/00 (2006.01); H04R 1/02 (2006.01); H04R 1/06 (2006.01); H04R 3/00 (2006.01); H04R 23/02 (2006.01); H03H 9/05 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H04R 1/222 (2013.01); B81B 7/0061 (2013.01); B81C 1/0023 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/97 (2013.01); H04R 1/02 (2013.01); H04R 1/06 (2013.01); H04R 3/007 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 23/02 (2013.01); H04R 31/00 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/012 (2013.01); B81B 2207/098 (2013.01); H01L 21/568 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/73217 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/19105 (2013.01); H03H 9/058 (2013.01); H03H 9/0523 (2013.01);
Abstract
The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.