The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Nov. 22, 2017
Applicant:

Snaptrack, Inc., San Diego, CA (US);

Inventors:

Hans Krüger, Munich, DE;

Alois Stelzl, Munich, DE;

Christian Bauer, Munich, DE;

Jürgen Portmann, Munich, DE;

Wolfgang Pahl, Munich, DE;

Assignee:

SnapTrack, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 41/23 (2013.01); H01L 41/113 (2006.01); H01L 41/083 (2006.01); H01L 41/053 (2006.01); H01L 41/27 (2013.01); H01L 41/293 (2013.01); B81B 7/00 (2006.01); H03H 9/05 (2006.01); H01L 41/297 (2013.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 41/23 (2013.01); B81B 7/007 (2013.01); B81B 7/0035 (2013.01); H01L 24/97 (2013.01); H01L 41/053 (2013.01); H01L 41/0533 (2013.01); H01L 41/083 (2013.01); H01L 41/1132 (2013.01); H01L 41/27 (2013.01); H01L 41/293 (2013.01); H01L 41/297 (2013.01); H03H 9/0557 (2013.01); B81B 2207/095 (2013.01); H01L 2224/11 (2013.01); H01L 2224/16225 (2013.01);
Abstract

A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.


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