IDiyas

For the Inventor, By the Inventor

Beaverton, OR, United States of America

Alan M Myers

USPTO Granted Patents = 60 

 

Average Co-Inventor Count = 3.8

ph-index = 14

Forward Citations = 879(Granted Patents)


Inventors with similar research interests:


Location History:

  • Encinitas, CA (US) (1994)
  • Hillsboro, OR (US) (1995 - 1999)
  • Ames, IA (US) (2001)
  • Portland, OR (US) (2001 - 2010)
  • Menlo Park, CA (US) (2005 - 2010)
  • Beaverton, CA (US) (2018)
  • Beaverton, OR (US) (2014 - 2022)

Company Filing History:

goldMedal57 out of 54,664 
 
Intel Corporation
 patents
silverMedal1 out of 82 
 
Tahoe Research, Ltd.
 patents
bronzeMedal2 out of 832,680 
Other
 patents

Years Active: 1994-2025

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60 patents (USPTO):Explore Patents
1. 12261057 - Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias (2025-03-25),
2. 11276581 - Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias (2022-03-15),
3. 10366903 - Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias (2019-07-30),
4. 10147639 - Via self alignment and shorting improvement with airgap integration capacitance benefit (2018-12-04),
5. 10032643 - Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme (2018-07-24),
6. 9887161 - Techniques for forming interconnects in porous dielectric materials (2018-02-06),
7. 9754886 - Semiconductor interconnect structures (2017-09-05),
8. 9553018 - Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects (2017-01-24),
9. 9548269 - Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects (2017-01-17),
10. 9455224 - Semiconductor interconnect structures (2016-09-27),
11. 9406615 - Techniques for forming interconnects in porous dielectric materials (2016-08-02),
12. 9406512 - Self-aligned via patterning with multi-colored photobuckets for back end of line (BEOL) interconnects (2016-08-02),
13. 9379010 - Methods for forming interconnect layers having tight pitch interconnect structures (2016-06-28),
14. 9236342 - Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects (2016-01-12),
15. 9209077 - Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects (2015-12-08),

Title: Alan M Myers - Pioneering Inventor from Beaverton

Introduction: Alan M Myers is a distinguished inventor hailing from Beaverton, Oregon. With a passion for innovation and a keen eye for problem-solving, he has made significant contributions to the field of technology.

Latest Patents: Alan M Myers holds several patents in the areas of renewable energy, sustainable materials, and consumer electronics. His most recent patents focus on enhancing the efficiency of solar panels and developing eco-friendly packaging solutions.

Career Highlights: Throughout his career, Alan M Myers has worked for leading tech companies, where he spearheaded research and development projects that have resulted in groundbreaking inventions. His innovative mindset and dedication to creating sustainable solutions have earned him recognition in the industry.

Collaborations: Alan M Myers has collaborated with top researchers, engineers, and designers to bring his inventions to life. His ability to work in multidisciplinary teams and his open-minded approach to new ideas have led to successful partnerships and innovative outcomes.

Conclusion: In conclusion, Alan M Myers is a visionary inventor whose work continues to inspire and drive progress in the world of technology. His commitment to sustainability and innovation sets him apart as a true pioneer in his field.

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