Portland, OR, United States of America

Akm Shaestagir Chowdhury

This inventor holds 6 USPTO granted patents and 4 published patent applications and 1 EPO patent. Top assignee: Intel Corporation. Active years: 2021-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akm Shaestagir Chowdhury. Retrieved from https://idiyas.com/inventor/akm-shaestagir-chowdhury

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 6 

% Patents Active = 83.3

 

Average Co-Inventor Count = 3.1

ph-index = 1


Company Filing History:


Years Active: 2021-2026

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6 patents (USPTO):Explore Patents

Title: Akm Shaestagir Chowdhury: Innovator in Semiconductor Technology

Introduction

Akm Shaestagir Chowdhury is a prominent inventor based in Portland, OR (US). He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on enhancing the efficiency and performance of integrated circuits.

Latest Patents

Chowdhury's latest patents include innovative solutions such as the "Simultaneous filling of variable aspect ratio single damascene contact to gate and trench vias with low resistance barrierless selective metallization." This patent describes an integrated circuit structure that features a first metal layer with conductive features and a second metal layer with additional conductive features. The design includes a via layer situated in an insulating layer between the two metal layers, with first and second vias formed in the insulating layer. The first vias have a greater aspect ratio compared to the second vias, allowing for a barrier-less metal to partially fill the first vias while completely filling the second vias. Additionally, a pure metal fills the remainder of the first vias.

Another notable patent is "Tungsten alloys in semiconductor devices," which details conducting alloys comprising cobalt, tungsten, and boron, as well as nickel, tungsten, and boron. These alloys are designed for use in metal interconnects and can serve as liner layers for traditional copper or copper alloy interconnects. The cobalt-tungsten and nickel-tungsten alloys can be deposited using electroless processes, showcasing Chowdhury's innovative approach to semiconductor materials.

Career Highlights

Chowdhury is currently employed at Intel Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing advanced materials and processes that enhance the performance of electronic devices.

Collaborations

Throughout his career, Chowdhury has collaborated with notable colleagues, including Yang Cao and Jeff Grunes. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Akm Shaestagir Chowdhury is a key figure in the semiconductor industry, with a strong portfolio of patents that reflect his expertise and innovative spirit. His contributions continue to shape the future of technology, making him a valuable asset to Intel Corporation and the broader field of semiconductor research.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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