The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Sep. 24, 2021
Intel Corporation, Santa Clara, CA (US);
Akm Shaestagir Chowdhury, Portland, OR (US);
Debashish Basu, Beaverton, OR (US);
Githin F. Alapatt, Portland, OR (US);
Justin E. Mueller, Portland, OR (US);
James Y. Jeong, Beaverton, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An integrated circuit structure comprises a first metal layer having first conductive features. A second metal layer has second conductive features. A via layer is in an insulating layer between the first metal layer and the second metal layer. First vias and second vias are formed in the insulating layer. The first vias have a first aspect ratio greater than a second aspect ratio of the second vias. A barrier-less metal partially fills the first vias and fills the second vias. A pure metal fills a remainder of the first vias.