The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 2022

Filed:

Mar. 27, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Nita Chandrasekhar, Portland, OR (US);

AKM Shaestagir Chowdhury, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5329 (2013.01); H01L 21/02115 (2013.01); H01L 21/76807 (2013.01); H01L 21/76826 (2013.01); H01L 21/76831 (2013.01); H01L 21/76843 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01);
Abstract

An integrated circuit structure, comprises a dielectric material having an opening therein, the opening defined by sides and a bottom. A graphene barrier material is conformal to the sides and the bottom of the opening, and a conductive metal over the graphene barrier material that fills at least a portion of a remainder of the opening in the dielectric material. The graphene barrier is formed by applying a non-hydrogen based plasma pretreatment to the dielectric surface, including the sides and the bottom of the opening, to substantially remove any passivation and provide an activated dielectric surface. A carbon-based precursor is exposed to the activated dielectric surface at less than approximately 400° C. to form the graphene barrier.


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