The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2021
Filed:
Jul. 25, 2014
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Yang Cao, Beaverton, OR (US);
Akm Shaestagir Chowdhury, Portland, OR (US);
Jeff Grunes, Beaverton, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/288 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53261 (2013.01); H01L 21/288 (2013.01); H01L 21/76843 (2013.01); H01L 21/76849 (2013.01); H01L 21/76877 (2013.01); H01L 23/53209 (2013.01); H01L 23/53238 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Conducting alloys comprising cobalt, tungsten, and boron and conducting alloys comprising nickel, tungsten, and boron are described. These alloys can, for example, be used to form metal interconnects, can be used as liner layers for traditional copper or copper alloy interconnects, and can act as capping layers. The cobalt-tungsten and nickel-tungsten alloys can be deposited using electroless processes.