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Tempe, AZ, United States of America

Third Dimension (3D) Semiconductor, Inc.

USPTO Granted Patents = 20

% Expired Patents = 95.0

Forward Citations = 266

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8 inventors (with patents filed for the assignee):

Fwu-Iuan Hshieh (12 out of 142 patents)

Brian D Pratt (4 out of 8 patents)

Richard A Blanchard (3 out of 271 patents)

4. Xingbi Chen (2 out of 18 patents)

5. Xing-bi Chen (2 out of 2 patents)

6. Koon Chong So (2 out of 67 patents)

7. Xing-Bi Chen (1 out of 1 patent)

8. Brain D Pratt (1 out of 1 patent)

20 patents: Sort by Forward Citations

1. 8071450 - Method for forming voltage sustaining layer with opposite-doped islands for semiconductor power devices (2011-12-06),

2. 7977745 - Tungsten plug drain extension (2011-07-12),

3. 7772086 - Process for high voltage superjunction termination (2010-08-10),

4. 7704864 - Method of manufacturing a superjunction device with conventional terminations (2010-04-27),

5. 7622787 - Process for high voltage superjunction termination (2009-11-24),

6. 7504305 - Technique for forming the deep doped regions in superjunction devices (2009-03-17),

7. 7498614 - Voltage sustaining layer with opposite-doped islands for semiconductor power devices (2009-03-03),

8. 7439583 - Tungsten plug drain extension (2008-10-21),

9. 7410891 - Method of manufacturing a superjunction device (2008-08-12),

10. 7364994 - Method for manufacturing a superjunction device with wide mesas (2008-04-29),

11. 7354818 - Process for high voltage superjunction termination (2008-04-08),

12. 7339252 - Semiconductor having thick dielectric regions (2008-03-04),

13. 7271067 - Voltage sustaining layer with opposite-doped islands for semiconductor power devices (2007-09-18),

14. 7227197 - Semiconductor high-voltage devices (2007-06-05),

15. 7199006 - Planarization method of manufacturing a superjunction device (2007-04-03),

Third Dimension (3D) Semiconductor, Inc. is a technology company based in Tempe, Arizona, specializing in advanced semiconductor solutions. The organization focuses on the development and manufacturing of innovative semiconductor products that enhance performance and efficiency across various applications. With a commitment to research and development, 3D Semiconductor is at the forefront of addressing the evolving needs of industries such as telecommunications, computing, and consumer electronics, contributing to the advancement of next-generation technologies.

Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

20 Patents

#33 in Tempe, AZ

#197 in Arizona

#16,368 in US

#31,196 in the World

Tempe, AZ, United States of America

Third Dimension (3D) Semiconductor, Inc.

Forward Citations = 266

8 inventors:

Fwu-Iuan Hshieh (12 out of 142 patents)

Brian D Pratt (4 out of 8 patents)

Richard A Blanchard (3 out of 271 patents)

4. Xingbi Chen (2 out of 18 patents)

5. Xing-bi Chen (2 out of 2 patents)

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