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Tempe, AZ, United States of America

Third Dimension (3d) Semiconductor, Inc.

USPTO Granted Patents = 20

Forward Citations = 266

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8 inventors (with patents filed for the assignee):

Fwu-Iuan Hshieh (12 out of 142 patents)

Brian D Pratt (4 out of 8 patents)

Richard A Blanchard (3 out of 271 patents)

4. Xingbi Chen (2 out of 18 patents)

5. Xing-bi Chen (2 out of 2 patents)

6. Koon Chong So (2 out of 67 patents)

7. Xing-Bi Chen (1 out of 1 patent)

8. Brain D Pratt (1 out of 1 patent)

20 patents: Sort by Forward Citations

1. 8071450 - Method for forming voltage sustaining layer with opposite-doped islands for semiconductor power devices (2011-12-06),

2. 7977745 - Tungsten plug drain extension (2011-07-12),

3. 7772086 - Process for high voltage superjunction termination (2010-08-10),

4. 7704864 - Method of manufacturing a superjunction device with conventional terminations (2010-04-27),

5. 7622787 - Process for high voltage superjunction termination (2009-11-24),

6. 7504305 - Technique for forming the deep doped regions in superjunction devices (2009-03-17),

7. 7498614 - Voltage sustaining layer with opposite-doped islands for semiconductor power devices (2009-03-03),

8. 7439583 - Tungsten plug drain extension (2008-10-21),

9. 7410891 - Method of manufacturing a superjunction device (2008-08-12),

10. 7364994 - Method for manufacturing a superjunction device with wide mesas (2008-04-29),

11. 7354818 - Process for high voltage superjunction termination (2008-04-08),

12. 7339252 - Semiconductor having thick dielectric regions (2008-03-04),

13. 7271067 - Voltage sustaining layer with opposite-doped islands for semiconductor power devices (2007-09-18),

14. 7227197 - Semiconductor high-voltage devices (2007-06-05),

15. 7199006 - Planarization method of manufacturing a superjunction device (2007-04-03),

Third Dimension (3D) Semiconductor, Inc. is a leading semiconductor company specializing in cutting-edge 3D chip design and manufacturing. Our innovative solutions enable higher performance, low-power consumption, and improved reliability for various industries, including consumer electronics, automotive, telecommunications, and more. With our state-of-the-art facilities and experienced team of engineers, we strive to revolutionize the semiconductor industry and provide our customers with exceptional products and services.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

20 Patents

#36 in Tempe, AZ

#201 in Arizona

#15,850 in US

#30,309 in the World

Tempe, AZ, United States of America

Third Dimension (3d) Semiconductor, Inc.

Forward Citations = 266

8 inventors:

Fwu-Iuan Hshieh (12 out of 142 patents)

Brian D Pratt (4 out of 8 patents)

Richard A Blanchard (3 out of 271 patents)

4. Xingbi Chen (2 out of 18 patents)

5. Xing-bi Chen (2 out of 2 patents)

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