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For the Inventor, By the Inventor

Tempe, AZ, United States of America

Third Dimension (3D) Semiconductor, Inc.

Calculating rank
USPTO Granted Patents = 20

% Expired Patents = 95.0

Forward Citations = 266

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8 inventors (with patents filed for the assignee):

goldMedal Fwu-Iuan Hshieh (12 out of 142 patents)

silverMedal Brian D Pratt (4 out of 8 patents)

bronzeMedal Richard A Blanchard (3 out of 271 patents)

4.  Xingbi Chen (2 out of 18 patents)

5.  Xing-bi Chen (2 out of 2 patents)

6.  Koon Chong So (2 out of 67 patents)

7.  Xing-Bi Chen (1 out of 1 patent)

8.  Brain D Pratt (1 out of 1 patent)


20 patents:

1. 8071450 - Method for forming voltage sustaining layer with opposite-doped islands for semiconductor power devices (2011-12-06),
2. 7977745 - Tungsten plug drain extension (2011-07-12),
3. 7772086 - Process for high voltage superjunction termination (2010-08-10),
4. 7704864 - Method of manufacturing a superjunction device with conventional terminations (2010-04-27),
5. 7622787 - Process for high voltage superjunction termination (2009-11-24),
6. 7504305 - Technique for forming the deep doped regions in superjunction devices (2009-03-17),
7. 7498614 - Voltage sustaining layer with opposite-doped islands for semiconductor power devices (2009-03-03),
8. 7439583 - Tungsten plug drain extension (2008-10-21),
9. 7410891 - Method of manufacturing a superjunction device (2008-08-12),
10. 7364994 - Method for manufacturing a superjunction device with wide mesas (2008-04-29),
11. 7354818 - Process for high voltage superjunction termination (2008-04-08),
12. 7339252 - Semiconductor having thick dielectric regions (2008-03-04),
13. 7271067 - Voltage sustaining layer with opposite-doped islands for semiconductor power devices (2007-09-18),
14. 7227197 - Semiconductor high-voltage devices (2007-06-05),
15. 7199006 - Planarization method of manufacturing a superjunction device (2007-04-03),
Company Overview
Third Dimension (3D) Semiconductor, Inc. is a technology company based in Tempe, Arizona, specializing in advanced semiconductor solutions. The organization focuses on the development and manufacturing of innovative semiconductor products that enhance performance and efficiency across various applications. With a commitment to research and development, 3D Semiconductor is at the forefront of addressing the evolving needs of industries such as telecommunications, computing, and consumer electronics, contributing to the advancement of next-generation technologies.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Nov 10 2026

20 Patents

#33 in Tempe, AZ

#197 in Arizona

#16,444 in US

#31,380 in the World

Tempe, AZ (US)
Tempe, AZ, United States of America

Third Dimension (3D) Semiconductor, Inc.

Forward Citations = 266

8 inventors:

goldMedal Fwu-Iuan Hshieh (12 out of 142 patents)

silverMedal Brian D Pratt (4 out of 8 patents)

bronzeMedal Richard A Blanchard (3 out of 271 patents)

4.  Xingbi Chen (2 out of 18 patents)

5.  Xing-bi Chen (2 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Third Dimension (3D) Semiconductor, Inc.. Retrieved from https://idiyas.com/company/third-dimension-3d-semiconductor

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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