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For the Inventor, By the Inventor

Mine, Japan

Sumitomo Metal (Smi) Electronics Devices, Inc.

USPTO Granted Patents = 24

% Expired Patents = 16.7

Forward Citations = 363

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40 inventors (with patents filed for the assignee):

goldMedal Masashi Fukaya (6 out of 13 patents)

silverMedal Junzo Fukuta (3 out of 13 patents)

bronzeMedal Takeshi Kasai (3 out of 3 patents)

4.  Yoshikazu Nakata (3 out of 3 patents)

5.  Shigehisa Tomabechi (2 out of 2 patents)

6.  Akihiro Hamano (2 out of 2 patents)

7.  Yoshio Tsukiyama (2 out of 2 patents)

8.  Masato Shiobara (2 out of 2 patents)

9.  Yoshinobu Watanabe (2 out of 4 patents)

10.  Chiaki Higuchi (2 out of 2 patents)

11.  Hideaki Araki (2 out of 7 patents)

12.  Toshihiro Nakai (2 out of 2 patents)

13.  Tohru Nomura (1 out of 10 patents)

14.  Akio Harada (1 out of 50 patents)

15.  Ichirou Muraki (1 out of 1 patent)


24 patents:

1. 7632716 - Package for high frequency usages and its manufacturing method (2009-12-15),
2. 7023084 - Plastic packaging with high heat dissipation and method for the same (2006-04-04),
3. 6861747 - Radiation type BGA package and production method therefor (2005-03-01),
4. 6781488 - Connected construction of a high-frequency package and a wiring board (2004-08-24),
5. 6620650 - Chip package and method for manufacturing the same (2003-09-16),
6. 6544654 - Thick-film resistor and ceramic circuit board (2003-04-08),
7. 6495394 - Chip package and method for manufacturing the same (2002-12-17),
8. 6489679 - High-frequency package (2002-12-03),
9. 6249053 - Chip package and method for manufacturing the same (2001-06-19),
10. 6242694 - Package for housing a photosemiconductor device (2001-06-05),
11. 6222582 - Image capture system (2001-04-24),
12. 6123874 - Thick-film resistor paste (2000-09-26),
13. 6054755 - Semiconductor package with improved moisture vapor relief function and (2000-04-25),
14. 6037045 - Thick-film paste and ceramic circuit substrate using the same (2000-03-14),
15. 5955938 - RuO.sub.2 resistor paste, substrate and overcoat system (1999-09-21),
Company Overview
Sumitomo Metal (Smi) Electronics Devices, Inc. is a prominent player in the electronics sector, specializing in the development and manufacturing of advanced electronic components. The company focuses on innovative technologies that cater to various applications, including semiconductors and electronic materials. With a strong emphasis on research and development, Smi aims to enhance the performance and reliability of electronic devices, contributing to advancements in industries such as telecommunications and consumer electronics. Headquartered in Mine, Japan, Smi leverages its expertise to meet the evolving demands of the global market.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 20 2026

24 Patents

#1 in Mine

#2,636 in Japan

#26,686 in the World

Mine, JP
Mine, Japan

Sumitomo Metal (Smi) Electronics Devices, Inc.

Forward Citations = 363

40 inventors:

goldMedal Masashi Fukaya (6 out of 13 patents)

silverMedal Junzo Fukuta (3 out of 13 patents)

bronzeMedal Takeshi Kasai (3 out of 3 patents)

4.  Yoshikazu Nakata (3 out of 3 patents)

5.  Shigehisa Tomabechi (2 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Sumitomo Metal (Smi) Electronics Devices, Inc.. Retrieved from https://idiyas.com/company/sumitomo-metal-smi-electronics-devices

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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