The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2000
Filed:
Oct. 09, 1998
Hiroshi Takamichi, Ube, JP;
Yoshikazu Nakada, Okayama, JP;
Abstract
In order that popcorning and delamination resulting from moisture vapor in a semiconductor package may be prevented, a vent hole is formed in a die-bonding area of a plastic substrate so as to extend vertically through the substrate. An upper open end of the vent hole is covered with a solder resist film and a semiconductor chip is die-bonded on the solder resist film. In the die-bonding step, the solder resist film prevents an adhesive agent from flowing into the vent hole through the upper open end, so that gas permeability of the vent hole can be ensured. Furthermore, since the solder resist film has gas permeability, moisture vapor in the package is released outside through the vent hole and the solder resist film during a reflow heating.