Location History:
- Onoda, JP (2005)
- Mine, JP (2006)
Company Filing History:
Years Active: 2005-2006
Title: Shigehisa Tomabechi: Innovator in High Heat Dissipation Packaging
Introduction
Shigehisa Tomabechi is a notable inventor based in Mine, Japan. He has made significant contributions to the field of electronics packaging, particularly in developing innovative solutions for high heat dissipation. With a total of 2 patents to his name, Tomabechi's work is recognized for its practicality and efficiency.
Latest Patents
Tomabechi's latest patents include a high heat dissipation plastic package and a method for the same. This invention provides an inexpensive, thin plastic package that offers good bonding precision and minimal bleeding of adhesive resin. The design features a Cu foil resin film bonded to a heat dissipation plate, with a cut-out for mounting semiconductor elements. Another significant patent is for a radiation type BGA package, which enhances thermal performance by joining a metal heat sink to a plastic circuit board. This package includes a clamping member that secures the components together, ensuring effective heat management.
Career Highlights
Shigehisa Tomabechi is currently employed at Sumitomo Metal Electronics Devices, Inc. His work at this company has allowed him to focus on developing advanced packaging solutions that meet the demands of modern electronics.
Collaborations
Tomabechi has collaborated with notable coworkers, including Akihiro Hamano and Takeshi Miyazaki. Their combined expertise has contributed to the successful development of innovative packaging technologies.
Conclusion
Shigehisa Tomabechi's contributions to high heat dissipation packaging demonstrate his commitment to innovation in the electronics industry. His patents reflect a deep understanding of the challenges faced in this field and provide practical solutions that enhance product performance.