The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2005

Filed:

Apr. 08, 2002
Applicants:

Takeshi Miyazaki, Sanda, JP;

Akihiro Hamano, Ube, JP;

Shigehisa Tomabechi, Onoda, JP;

Inventors:

Takeshi Miyazaki, Sanda, JP;

Akihiro Hamano, Ube, JP;

Shigehisa Tomabechi, Onoda, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/34 ;
U.S. Cl.
CPC ...
Abstract

(1) A thermal enhanced type of BGA package, in which a metal heat sink is joined to one side of a plastic circuit board which has a cutout space in the central portion, comprised of a clamping member joining the plastic circuit board and the heat sink. A caulking member, a rivet, a screw, an eyelet, or a tubular rivet could be used as the clamping member. It is preferable that a dam member is definitely attached by the clamping member. (2) Another thermal enhanced type of BGA package, in which a circuit pattern is provided in the plastic circuit board and the heat sink and/or the dam member are electrically connected to a part of the circuit pattern through the clamping member. It is preferable to use the clamping member coated by solder.


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