Company Filing History:
Years Active: 2001-2003
Title: Innovations of Yoshikazu Nakata
Introduction
Yoshikazu Nakata is a notable inventor based in Shiga, Japan. He has made significant contributions to the field of electronics, particularly in chip packaging technology. With a total of 3 patents to his name, Nakata continues to push the boundaries of innovation in his industry.
Latest Patents
One of Nakata's latest patents is focused on a chip package and method for manufacturing the same. In this invention, a Ni/Au layer is formed by electroplating, which addresses the issue of low adhesive strength of solder balls to ball pads. By eliminating the need for leads for plating, the adhesion becomes more stable. This innovation not only improves the adhesive strength but also enhances the density of interconnections and the overall electrical properties of the chip package. The Ni/Au layer is applied to the base metal layer surface that is not covered with a Dry Film Resist (DFR) by using an electric current.
Career Highlights
Yoshikazu Nakata is currently employed at Sumitomo Metal Electronics Devices, Inc. His work at this company has allowed him to develop and refine his innovative ideas in the field of electronics.
Collaborations
Nakata collaborates with Takeshi Kasai, a fellow innovator in the industry. Their partnership has contributed to the advancement of technology in chip packaging.
Conclusion
Yoshikazu Nakata's contributions to the field of electronics through his innovative patents demonstrate his commitment to improving technology. His work continues to influence the industry and pave the way for future advancements.