The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2009

Filed:

May. 09, 2006
Applicants:

Ichirou Muraki, Mine, JP;

Kouichi Nakasu, Onoda, JP;

Akiyoshi Osakada, Mine, JP;

Inventors:

Ichirou Muraki, Mine, JP;

Kouichi Nakasu, Onoda, JP;

Akiyoshi Osakada, Mine, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/024 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A package for high frequency usageshas a notched areaon each longitudinal end of a substantially rectangular heat sink platefor fastening the package to a basewith a screw. The package includes a joined memberformed by joining a surface of a ring-like frame membermade of a ceramic material to the longitudinal center of a surface of heat sink plateand joining another surface to an external connection terminal. The other surface of heat sink platepresents a curved protruding shapebowing from its longitudinal ends toward its longitudinal center, so that curved protruding shapecauses at least an area of the other surface heat sink platethat corresponds to an area dedicated for mounting a semiconductor devicewithin ring-like frame memberto make a close contact with basewhen the package is fastened to baseby the screw at notched areas


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