For the Inventor, By the Inventor

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Singapore, Singapore

Stat Chippac Ltd.

USPTO Granted Patents = 3

Forward Citations = 38

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10 inventors (with patents filed for the assignee):

Won Kyoung Choi (1 out of 30 patents)

DaeSik Choi (1 out of 78 patents)

OhHan Kim (1 out of 33 patents)

4. SungWon Cho (1 out of 43 patents)

5. KyuWon Lee (1 out of 16 patents)

6. DongSoo Moo (1 out of 2 patents)

7. Zigmund Ramirez Camacho (1 out of 219 patents)

8. Pandi Chelvam Marimuthu (1 out of 102 patents)

9. Frederick Rodriguez Dahilig (1 out of 19 patents)

10. Henry Descalzo Bathan (1 out of 101 patents)

3 patents: Sort by Forward Citations

1. 8810015 - Integrated circuit packaging system with high lead count and method of manufacture thereof (2014-08-19),

2. 8435881 - Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation (2013-05-07),

3. 8273604 - Semiconductor device and method of forming WLCSP structure using protruded MLP (2012-09-25),

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USPTO Data Jan 1 1976 - Dec 9 2025

3 Patents

#435 in Singapore

#436 in Singapore

Singapore, Singapore

Stat Chippac Ltd.

Forward Citations = 38

10 inventors:

Won Kyoung Choi (1 out of 30 patents)

DaeSik Choi (1 out of 78 patents)

OhHan Kim (1 out of 33 patents)

4. SungWon Cho (1 out of 43 patents)

5. KyuWon Lee (1 out of 16 patents)

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