The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2012
Filed:
Feb. 22, 2011
Ohhan Kim, Kyonggi-do, KR;
Sungwon Cho, Kyoung-gi-Do, KR;
Daesik Choi, Seoul, KR;
Kyuwon Lee, Kyoungki-Do, KR;
Dongsoo Moo, Kyonggi-do, KR;
OhHan Kim, Kyonggi-do, KR;
SungWon Cho, Kyoung-gi-Do, KR;
DaeSik Choi, Seoul, KR;
KyuWon Lee, Kyoungki-Do, KR;
DongSoo Moo, Kyonggi-do, KR;
STAT ChipPAC, Ltd., Singapore, SG;
Abstract
A semiconductor device can include a carrier substrate, and a first semiconductor die disposed on a surface of the carrier substrate. An encapsulant can be disposed over the first semiconductor die and the carrier substrate. The semiconductor device can include first vias disposed through the encapsulant as well as second vias disposed through the encapsulant to expose first contact pads. The first contact pads are on upper surfaces of the first semiconductor die. The semiconductor device can include conductive pillars that fill the first vias, and first conductive metal vias (CMVs) that fill the second vias. The conductive pillar can include a first conductive material, and the first CMVs can be in contact with the first contact pads. The semiconductor device can include a conductive layer disposed over the encapsulant. The conductive layer can electrically connect one of the first CMVs with one of the conductive pillars.