Company Filing History:
Years Active: 2012-2013
Title: Innovations of DongSoo Moo in Semiconductor Technology
Introduction
DongSoo Moo is a notable inventor based in Kyonggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to device design and manufacturing.
Latest Patents
His latest patents include a semiconductor device and a method of forming a Wafer-Level Chip Scale Package (WLCSP) structure using protruded Multi-Layer Package (MLP). This semiconductor device features a carrier substrate with a first semiconductor die placed on its surface. An encapsulant is applied over the first semiconductor die and the carrier substrate. The device incorporates first vias and second vias that are disposed through the encapsulant to expose first contact pads located on the upper surfaces of the first semiconductor die. Conductive pillars fill the first vias, while first conductive metal vias (CMVs) fill the second vias, establishing contact with the first contact pads. Additionally, a conductive layer is positioned over the encapsulant, electrically connecting one of the first CMVs with one of the conductive pillars.
Career Highlights
Throughout his career, DongSoo Moo has worked with prominent companies in the semiconductor industry, including Stats Chippac Pte. Ltd. and STATS ChipPAC Ltd. His experience in these organizations has contributed to his expertise in semiconductor device development.
Collaborations
DongSoo Moo has collaborated with talented individuals such as OhHan Kim and SungWon Cho, further enhancing his innovative work in the semiconductor field.
Conclusion
DongSoo Moo's contributions to semiconductor technology through his patents and career experiences highlight his role as a significant inventor in the industry. His work continues to influence advancements in semiconductor devices and manufacturing processes.