For the Inventor, By the Inventor

Enter assignee name

San-Ei Kagaku Co., Ltd.

USPTO Granted Patents = 23

EPO Patents = 1

Trademarks = 4

Forward Citations = 95

Loading Chart...

Loading Chart...

27 inventors (with patents filed for the assignee):

Kazunori Kitamura (10 out of 10 patents)

Katsuhiro Watanabe (8 out of 16 patents)

Toshio Ohta (5 out of 14 patents)

4. Michihiro Aga (5 out of 5 patents)

5. Yasuhiro Takase (4 out of 4 patents)

6. Kiyoshi Sato (4 out of 126 patents)

7. Kazuki Hanada (3 out of 3 patents)

8. Yukihiro Usui (2 out of 2 patents)

9. Yukihiro Koga (2 out of 2 patents)

10. Toshio Horikoshi (2 out of 2 patents)

11. Masayuki Minei (2 out of 2 patents)

12. Kazuya Takahashi (1 out of 62 patents)

13. Takeshi Saito (1 out of 120 patents)

14. Hiroshi Asami (1 out of 1 patent)

15. Takashi Akiyama (1 out of 68 patents)

23 patents: Sort by Forward Citations

1. 12412859 - Via wiring formation substrate, manufacturing method for via wiring formation substrate, and semiconductor device mounting component (2025-09-09),

2. 10870725 - Heat curable resin composition, and circuit board with electronic component mounted thereon (2020-12-22),

3. 9732183 - Method for manufacturing hole-filling printed wiring board, curable resin composition and hole-filling printed wiring board (2017-08-15),

4. 9565754 - Solder-mounted board, production method therefor, and semiconductor device (2017-02-07),

5. 9415469 - Resin composition for solder bump formation, solder bump formation method, and member having solder bumps (2016-08-16),

6. 9201299 - Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same (2015-12-01),

7. 9072205 - Surface mounting method utilizing active resin composition (2015-06-30),

8. 8758986 - Printed wiring board and method for producing the same (2014-06-24),

9. 8551819 - Method for surface mounting using cleaning-free activated resinous composition (2013-10-08),

10. 8232477 - Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board (2012-07-31),

11. 8153109 - Alkylene carbonate dilution, alkylene carbonate for preparing the dilution, and aqueous reducing chemical agent (2012-04-10),

12. 7718817 - Vegetable sterol ester-containing composition and additive that increases the feeling effects from a hair cosmetic (2010-05-18),

13. 7410673 - Smooth board and process for preparing a smooth board (2008-08-12),

14. 7396885 - Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board (2008-07-08),

15. 7150868 - Composition for blending to hair treating agent and hair treating agent (2006-12-19),

San-Ei Kagaku Co., Ltd. is a Japanese company specializing in the development, manufacturing, and distribution of scientific equipment and laboratory supplies. With over 50 years of experience, San-Ei Kagaku has established itself as a leader in the industry, providing high-quality products and innovative solutions to customers worldwide.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

23 Patents

#1,091 in Tokyo

#2,646 in Japan

#26,841 in the World

San-Ei Kagaku Co., Ltd.

Forward Citations = 95

27 inventors:

Kazunori Kitamura (10 out of 10 patents)

Katsuhiro Watanabe (8 out of 16 patents)

Toshio Ohta (5 out of 14 patents)

4. Michihiro Aga (5 out of 5 patents)

5. Yasuhiro Takase (4 out of 4 patents)

Please report any incorrect information to support@idiyas.com

Loading…