The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
Feb. 15, 2013
Applicant:
San-el Kagaku Co., Ltd., Tokyo, JP;
Inventors:
Toshimitsu Kounou, Saitama, JP;
Yasuhiro Kuroyanagai, Saitama, JP;
Yukihiro Usui, Saitama, JP;
Makoto Obunai, Saitama, JP;
Assignee:
SAN-EI KAGAKU CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/029 (2006.01); G03F 7/004 (2006.01); C08L 33/14 (2006.01); C08L 63/04 (2006.01); G03F 7/038 (2006.01); G03F 7/075 (2006.01); C08F 20/28 (2006.01); G03F 7/033 (2006.01);
U.S. Cl.
CPC ...
G03F 7/004 (2013.01); C08F 20/28 (2013.01); C08L 33/14 (2013.01); C08L 63/04 (2013.01); G03F 7/0382 (2013.01); G03F 7/0385 (2013.01); G03F 7/0388 (2013.01); G03F 7/0757 (2013.01); G03F 7/033 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0212 (2013.01);
Abstract
A curable resin composition comprises: (I) 100 parts by weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 μm, wherein a content weight ratio of the components (II) and (III) is 1 to 41.