Yukihiro Usui

Title: Innovations of Yukihiro Usui

Introduction

Yukihiro Usui is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of printed wiring boards, holding two patents that showcase his innovative approach to manufacturing and materials.

Latest Patents

Usui's latest patents include a method for manufacturing a hole-filling printed wiring board and a curable resin composition. The first patent describes a back drilling method to remove redundant parts of a plated through hole in a printed wiring board. It involves filling the penetration hole entirely with a curable resin composition, which is initially heated to a temperature below 100°C to achieve a curing rate of 60% to 85%. The composition is then heated to a temperature between 130°C and 200°C for complete curing. The curable resin composition consists of a specific ratio of curing agent to liquid epoxy resin, and it contains no solvent. His second patent focuses on a curable resin composition that includes a combination of inorganic and organic fillers, designed for resist film coated printed wiring boards.

Career Highlights

Yukihiro Usui is currently employed at San-ei Kagaku Co., Ltd., where he continues to develop innovative solutions in the electronics industry. His work has significantly impacted the manufacturing processes of printed wiring boards, enhancing their efficiency and reliability.

Collaborations

Usui has collaborated with notable coworkers, including Toshimitsu Kounou and Yasuhiro Kuroyanagai. Their combined expertise has contributed to the advancement of technologies in their field.

Conclusion

Yukihiro Usui's contributions to the field of printed wiring boards through his patents and collaborations highlight his role as an influential inventor. His innovative methods and compositions continue to shape the industry and improve manufacturing practices.