San-Ei Kagaku Co., Ltd.

Yukihiro Usui

Kazuya Takahashi

Kazunori Kitamura

Yasuhiro Kuroyanagai

Makoto Obunai

Toshimitsu Kounou

A redundant part of a plated through hole that is formed in a printed wiring board is removed by a back drilling method; a penetration hole is filled entirely with a curable resin composition for hole filling; the curable resin composition is initially heated at a temperature less than 100&#xb0; C. so that a curing rate of the curable resin composition may be 60% to 85%; and the curable resin composition is subsequently heated at a temperature 130&#xb0; C. to 200&#xb0; C. so that the curable resin composition may be cured completely, where the curable resin composition contains 1 part by mass to 200 parts by mass of a curing agent with respect to 100 parts by mass of liquid epoxy resin, and contains no solvent.

Method for manufacturing hole-filling printed wiring board, curable resin composition and hole-filling printed wiring board

A curable resin composition comprises: (I) 100 parts by weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 &#x3bc;m, wherein a content weight ratio of the components (II) and (III) is 1 to 41.

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Saitama, Japan

Yukihiro Usui