The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2008
Filed:
Aug. 18, 2004
Applicants:
Kiyoshi Sato, Tokyo, JP;
Kazunori Kitamura, Tokyo, JP;
Inventors:
Kiyoshi Sato, Tokyo, JP;
Kazunori Kitamura, Tokyo, JP;
Assignee:
San-ei Kagaku Co., Ltd., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/02 (2006.01); B05D 3/10 (2006.01); B05D 3/12 (2006.01); C08L 63/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin with unsaturated aliphatic acid, (II) a (meth) acrylate, (III) a radical polymerization initiator, (IV) a crystallizable epoxy resin, and (V) a latent curing agent.