The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2020
Filed:
Apr. 05, 2017
Applicant:
San-ei Kagaku Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SAN-EI KAGAKU CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/40 (2006.01); H05K 3/34 (2006.01); C08K 5/315 (2006.01); C08K 5/3492 (2006.01); C08K 7/20 (2006.01); H01L 21/56 (2006.01); C08K 3/36 (2006.01); C08K 3/22 (2006.01); H01L 23/29 (2006.01); C08L 63/00 (2006.01); C08G 59/00 (2006.01); C08G 59/50 (2006.01); C08G 59/24 (2006.01); C08L 29/14 (2006.01); C08L 35/08 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
C08G 59/4014 (2013.01); C08G 59/00 (2013.01); C08G 59/5033 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08K 5/315 (2013.01); C08K 5/3492 (2013.01); C08K 7/20 (2013.01); C08L 63/00 (2013.01); H01L 21/563 (2013.01); H01L 23/293 (2013.01); H05K 3/3436 (2013.01); H05K 3/386 (2013.01); C08G 59/245 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/003 (2013.01); C08K 2201/005 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83192 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/085 (2013.01); H05K 2203/1178 (2013.01); H05K 2203/1189 (2013.01); Y02P 70/50 (2015.11);
Abstract
A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.