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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9415469 B1

PDFFull Text
Date of Patent:
Aug. 16, 2016

Filed:

Jul. 25, 2014

Resin composition for solder bump formation, solder bump formation method, and member having solder bumps

Applicant:

San-ei Kagaku Co., Ltd., Tokyo, JP;

Inventors:

Yasuhiro Takase, Saitama, JP;

Kazuki Hanada, Saitama, JP;

Kazunori Kitamura, Saitama, JP;

Assignee:

SAN-EI KAGAKU CO., LTD., Tokyo, JP;

Attorney:

Young & Thompson

Primary Examiner:

Asok K Sarkar

Int. Cl.
CPC ...
B23K 35/36 (2006.01); H05K 1/09 (2006.01); B23K 35/02 (2006.01); B23K 1/20 (2006.01); B23K 1/00 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3613 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); B23K 3/0638 (2013.01); B23K 3/08 (2013.01); B23K 35/025 (2013.01); B23K 35/0222 (2013.01); B23K 35/0244 (2013.01); B23K 35/3612 (2013.01); H05K 3/3484 (2013.01); B23K 2201/42 (2013.01); H01L 2224/11 (2013.01); H05K 2203/0139 (2013.01); H05K 2203/043 (2013.01); H05K 2203/0425 (2013.01); H05K 2203/0445 (2013.01); H05K 2203/0588 (2013.01); H05K 2203/0769 (2013.01); H05K 2203/0773 (2013.01); H05K 2203/111 (2013.01);
Abstract

The present invention provides a solder bump formation resin composition which ensures resist (e.g., dry film) removability and which exhibits excellent solder bonding performance, even when the working substrate is placed at high temperature during reflowing, baking, or a similar process. The solder bump formation resin composition contains (A) at least one species selected from among an alkali-dissoluble thermoplastic resin having an acid value (mgKOH/g) of 110 or higher, an unsaturated fatty acid polymer having an acid value of 80 or higher, and an unsaturated fatty acid-aliphatic unsaturated compound copolymer having an acid value of 50 or higher; (B) a solvent; and (C) a solder powder, and contains no activating agent.

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