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Kanagawa, Japan

Meiko Electronics Co., Ltd.

USPTO Granted Patents = 30

EPO Patents = 8

Trademarks = 1

Forward Citations = 180

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66 inventors (with patents filed for the assignee):

Shigeru Michiwaki (9 out of 12 patents)

Mitsuaki Toda (6 out of 6 patents)

Tatsuo Wada (5 out of 10 patents)

4. Kunio Mori (4 out of 14 patents)

5. Yusuke Matsuno (4 out of 6 patents)

6. Katsuhito Mori (4 out of 7 patents)

7. Takahiro Kudo (4 out of 6 patents)

8. Manabu Miyawaki (4 out of 4 patents)

9. Tohru Matsumoto (4 out of 4 patents)

10. Ryoichi Shimizu (3 out of 3 patents)

11. Yoshio Imamura (3 out of 3 patents)

12. Noriaki Taneko (3 out of 3 patents)

13. Shukichi Takii (3 out of 3 patents)

14. Teruaki Yamamoto (2 out of 19 patents)

15. Shuukichi Takii (2 out of 2 patents)

30 patents: Sort by Forward Citations

1. 12009282 - Memory device and memory device module (2024-06-11),

2. 11128190 - Rotary machine coil using a winding electric wire (2021-09-21),

3. 10665568 - Encapsulated circuit module, and production method therefor (2020-05-26),

4. 10537021 - Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board (2020-01-14),

5. 10385076 - Surface treatment agent and novel compound (2019-08-20),

6. 10244624 - Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board (2019-03-26),

7. 9793218 - Method for manufacturing device embedded substrate, and device embedded substrate (2017-10-17),

8. 9790242 - Surface treatment method, surface treatment agent, and novel compound (2017-10-17),

9. 9756732 - Device embedded substrate and manufacturing method of device embedded substrate (2017-09-05),

10. 9622352 - Manufacturing method for component incorporated substrate and component incorporated substrate (2017-04-11),

11. 9596765 - Manufacturing method for component incorporated substrate and component incorporated substrate manufactured using the method (2017-03-14),

12. 9593423 - Process for forming metal film, and product equipped with metal film (2017-03-14),

13. 9526182 - Component-embedded substrate manufacturing method (2016-12-20),

14. 9380711 - Substrate manufacturing method (2016-06-28),

15. 9363885 - Method of fabricating heat dissipating board (2016-06-07),

MEIKO ELECTRONICS CO., LTD. is a leading electronic manufacturing services (EMS) company based in Japan. Established in 1969, MEIKO specializes in the design, development, and production of high-quality electronic components, modules, and devices. With state-of-the-art manufacturing facilities and advanced technologies, MEIKO delivers innovative solutions for a wide range of industries including automotive, telecommunications, medical, consumer electronics, and more. Committed to delivering exceptional quality and customer satisfaction, MEIKO provides comprehensive services such as PCB assembly, box build, testing, and logistics. Through a global network of strategic partnerships and offices, MEIKO operates internationally to serve clients worldwide and enhance their competitiveness in the global market.

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Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

30 Patents

#74 in Kanagawa

#2,253 in Japan

#21,180 in the World

Kanagawa, Japan

Meiko Electronics Co., Ltd.

Forward Citations = 180

66 inventors:

Shigeru Michiwaki (9 out of 12 patents)

Mitsuaki Toda (6 out of 6 patents)

Tatsuo Wada (5 out of 10 patents)

4. Kunio Mori (4 out of 14 patents)

5. Yusuke Matsuno (4 out of 6 patents)

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