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Kanagawa, Japan

Meiko Electronics Co., Ltd.

USPTO Granted Patents = 30

% Expired Patents = 43.3

EPO Patents = 8

Trademarks = 1

Forward Citations = 183

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55 inventors (with patents filed for the assignee):

Shigeru Michiwaki (9 out of 12 patents)

Mitsuaki Toda (6 out of 6 patents)

Tatsuo Wada (5 out of 10 patents)

4. Kunio Mori (4 out of 14 patents)

5. Yusuke Matsuno (4 out of 6 patents)

6. Katsuhito Mori (4 out of 7 patents)

7. Takahiro Kudo (4 out of 6 patents)

8. Manabu Miyawaki (4 out of 4 patents)

9. Tohru Matsumoto (4 out of 4 patents)

10. Ryoichi Shimizu (3 out of 3 patents)

11. Yoshio Imamura (3 out of 3 patents)

12. Noriaki Taneko (3 out of 3 patents)

13. Shukichi Takii (3 out of 3 patents)

14. Teruaki Yamamoto (2 out of 19 patents)

15. Shuukichi Takii (2 out of 2 patents)

Core Competencies:

Memory Device

Wiring Board

Surface Treatment

Metal Film

Embedded Substrate

Copper-Clad Laminate

Optical Fiber Connector

Circuit Board

Production Method

Heat Dissipating Board

Component Incorporation

30 patents: Sort by Forward Citations

1. 12009282 - Memory device and memory device module (2024-06-11),

2. 11128190 - Rotary machine coil using a winding electric wire (2021-09-21),

3. 10665568 - Encapsulated circuit module, and production method therefor (2020-05-26),

4. 10537021 - Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board (2020-01-14),

5. 10385076 - Surface treatment agent and novel compound (2019-08-20),

6. 10244624 - Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board (2019-03-26),

7. 9793218 - Method for manufacturing device embedded substrate, and device embedded substrate (2017-10-17),

8. 9790242 - Surface treatment method, surface treatment agent, and novel compound (2017-10-17),

9. 9756732 - Device embedded substrate and manufacturing method of device embedded substrate (2017-09-05),

10. 9622352 - Manufacturing method for component incorporated substrate and component incorporated substrate (2017-04-11),

11. 9596765 - Manufacturing method for component incorporated substrate and component incorporated substrate manufactured using the method (2017-03-14),

12. 9593423 - Process for forming metal film, and product equipped with metal film (2017-03-14),

13. 9526182 - Component-embedded substrate manufacturing method (2016-12-20),

14. 9380711 - Substrate manufacturing method (2016-06-28),

15. 9363885 - Method of fabricating heat dissipating board (2016-06-07),

Company Overview

Meiko Electronics Co., Ltd. is a prominent manufacturer specializing in advanced electronic components and systems. The company focuses on the development of high-quality printed circuit boards (PCBs) and related technologies, catering to various industries including telecommunications, automotive, and consumer electronics. With a strong emphasis on innovation, Meiko integrates cutting-edge manufacturing processes and research capabilities to deliver reliable solutions that meet the evolving demands of the global market.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

30 Patents

#80 in Kanagawa

#2,303 in Japan

#21,853 in the World

Kanagawa, Japan

Meiko Electronics Co., Ltd.

Forward Citations = 183

55 inventors:

Shigeru Michiwaki (9 out of 12 patents)

Mitsuaki Toda (6 out of 6 patents)

Tatsuo Wada (5 out of 10 patents)

4. Kunio Mori (4 out of 14 patents)

5. Yusuke Matsuno (4 out of 6 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Meiko Electronics Co., Ltd.. Retrieved from https://idiyas.com/company/meiko-electronics-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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