The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Sep. 30, 2011
Shukichi Takii, Ayase, JP;
Noriaki Taneko, Ayase, JP;
Shigeru Michiwaki, Ayase, JP;
Mitsuho Kurosu, Ayase, JP;
Yuichiro Naya, Ayase, JP;
Shukichi Takii, Ayase, JP;
Noriaki Taneko, Ayase, JP;
Shigeru Michiwaki, Ayase, JP;
Mitsuho Kurosu, Ayase, JP;
Yuichiro Naya, Ayase, JP;
MEIKO ELECTRONICS CO., LTD., Ayase-shi, Kanagawa, JP;
Abstract
A substrate manufacturing method includes an inner layer circuit forming step for partially removing metal films from an insulating base material (), on both surfaces of which the metal films are stuck, and forming an inner layer circuit (); and an insulating layer forming step for applying first insulating resin () to each of both the surfaces of the insulating base material () with an inkjet system and forming an insulating layer (). In the insulating layer forming step, a via hole () from which the inner layer circuit () is partially exposed is formed simultaneously with the application of the first insulating resin (). Consequently, a step of separately forming a via hole with a laser or the like is unnecessary, expenses are relatively low, and it is possible to simplify a manufacturing process.