The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2020
Filed:
Dec. 12, 2014
Meiko Electronics Co., Ltd., Ayase-shi, Kanagawa, JP;
Satoru Miwa, Nagoya, JP;
MEIKO ELECTRONICS CO., LTD., Kanagawa, JP;
Abstract
To provide a technique of preventing, in an encapsulated circuit module having a metal shield layer covering a surface of a resin layer containing filler, the shield layer from falling off. In manufacturing encapsulated circuit modules, first, a substrateis covered with a first resincontaining filler together with an electronic component. Next, a surface of the first resinis covered with a second resincontaining no filler. Subsequently, a ground electrodein the substrateis exposed by snicking and then a shield layerthat covers the entire surface of the substrateis formed by electroless plating. Thereafter, snipping is performed to obtain a number of encapsulated circuit modules.