The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Mar. 18, 2014
Kunio Mori, Morioka-shi, JP;
Sulfur Chemical Laboratory Incorporated, Morioka-shi, JP;
Meiko Electronics Co., Ltd., Ayase-shi, JP;
Kunio Mori, Morioka, JP;
Yusuke Matsuno, Morioka, JP;
Katsuhito Mori, Morioka, JP;
Takahiro Kudo, Morioka, JP;
Shigeru Michiwaki, Yokohama, JP;
Manabu Miyawaki, Fujisawa, JP;
Other;
Sulfur Chemical Laboratory Incorporated, Morioka-shi, JP;
Meiko Electronics Co., Ltd., Ayase-shi, JP;
Abstract
The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.