The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2016
Filed:
Oct. 31, 2011
Ryoichi Shimizu, Ayase, JP;
Tohru Matsumoto, Ayase, JP;
Takuya Hasegawa, Ayase, JP;
Yoshio Imamura, Ayase, JP;
Ryoichi Shimizu, Ayase, JP;
Tohru Matsumoto, Ayase, JP;
Takuya Hasegawa, Ayase, JP;
Yoshio Imamura, Ayase, JP;
MEIKO ELECTRONICS CO., LTD., Ayase-shi, Kanagawa, JP;
Abstract
The method includes positioning an electronic component using main marks formed on a metal layer and mounting the electronic component on a second surface of the metal layer with an adhesive layer interposed between the metal layer and both of the electronic component and terminals; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and forming a first window for exposing the main marks therefrom and a second window for exposing the adhesive layer including a position corresponding to the terminal therefrom; then using the exposed main marks as references and forming a laser via hole LVH reaching the terminal in the adhesive layer exposed from the second window; and thereby forming a wiring pattern from the metal layer electrically connected to the terminal through a first conductive via formed by plating the LVH with copper.