The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2020
Filed:
Dec. 21, 2018
Meiko Electronics Co., Ltd., Ayase-shi, Kanagawa, JP;
Shigeru Michiwaki, Ayase, JP;
MEIKO ELECTRONICS CO., LTD., Kanagawa, JP;
Abstract
A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film () having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film () on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film () on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.