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Taoyuan, Taiwan

Iteq Corporation

USPTO Granted Patents = 25

% Expired Patents = 32.0

Forward Citations = 11

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39 inventors (with patents filed for the assignee):

Li-Chun Chen (9 out of 11 patents)

Kai-Yang Chen (3 out of 3 patents)

Meng-Song Yin (3 out of 3 patents)

4. Bin Jian (3 out of 3 patents)

5. Sheng-yen Wu (3 out of 3 patents)

6. Ming-Hung Huang (2 out of 2 patents)

7. Yen-Hsing Wu (2 out of 10 patents)

8. Chen-Hsi Cheng (2 out of 5 patents)

9. Yufang He (2 out of 2 patents)

10. Lijun Su (2 out of 2 patents)

11. Chen-Hao Chang (2 out of 2 patents)

12. Kuo-Chan Chiou (1 out of 26 patents)

13. Chun-Chieh Huang (1 out of 39 patents)

14. Feng-Po Tseng (1 out of 9 patents)

15. Chun-Hao Chang (1 out of 2 patents)

Core Competencies:

Toughened Resin

Thermally Conductive Resin

Halogen-Free Epoxy

Dielectric Materials

Copper Clad Laminate

Prepreg

Circuit Board

Electromagnetic Shielding

Varnish Composition

Thermosetting Resin

Low Dielectric Loss

Laminated Substrate

25 patents: Sort by Forward Citations

1. 12735533 - Toughened resin composition (2026-09-15),

2. 12565582 - Resin composition and metal clad substrate (2026-03-03),

3. 12415339 - Resin composition and metal clad substrate (2025-09-16),

4. 11503708 - Resin composition, prepreg, and printed circuit board (2022-11-15),

5. 10752744 - Thermally conductive resin, resin composition, prepreg, and copper clad laminate (2020-08-25),

6. 10696783 - Resin composition, prepreg, and copper clad laminate (2020-06-30),

7. 10611910 - Halogen-free epoxy resin composition having low dielectric loss (2020-04-07),

8. 10518503 - Laminated substrate (2019-12-31),

9. 9771456 - Polyimide resins containing polymaleic anhydride and method for manufacturing the same (2017-09-26),

10. 9674992 - Electromagnetic interference shielding film (2017-06-06),

11. 9455067 - Low dielectric materials (2016-09-27),

12. 9257212 - Dielectric material with low dielectric loss (2016-02-09),

13. 9245667 - Circuit board (2016-01-26),

14. 8663803 - Varnish composition, and pre-impregnated manufacture thereof (2014-03-04),

15. 8217099 - Thermosetting resin composition (2012-07-10),

Company Overview

Iteq Corporation, based in Taoyuan, Taiwan, specializes in the development and manufacturing of advanced materials for the electronics industry. The company focuses on high-performance substrates and laminates, catering to the needs of various sectors including telecommunications, automotive, and consumer electronics. Iteq is committed to innovation in material science, providing solutions that enhance the efficiency and reliability of electronic devices. Their expertise in this domain positions them as a key player in the global electronics supply chain.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

25 Patents

#65 in Taoyuan

#688 in Taiwan

#25,710 in the World

Taoyuan, Taiwan

Iteq Corporation

Forward Citations = 11

39 inventors:

Li-Chun Chen (9 out of 11 patents)

Kai-Yang Chen (3 out of 3 patents)

Meng-Song Yin (3 out of 3 patents)

4. Bin Jian (3 out of 3 patents)

5. Sheng-yen Wu (3 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Iteq Corporation. Retrieved from https://idiyas.com/company/iteq

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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