The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Oct. 12, 2022
Iteq Corporation, Hsinchu County, TW;
Sheng-Yen Wu, Hsinchu County, TW;
PO-Hsun Lee, Hsinchu County, TW;
Chun-Ming Chiu, Hsinchu County, TW;
Wen-Pin Su, Hsinchu County, TW;
Jui-Teng Hsu, Hsinchu County, TW;
Chen-Yu Huang, Hsinchu County, TW;
Chun-Han Lin, Hsinchu County, TW;
ITEQ CORPORATION, Hsinchu County, TW;
Abstract
The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a styrene maleic anhydride compound, an anhydride grafted olefin polymer, and a diisocyanate compound; (B) a thermosetting polymer; and (C) a toughening resin; wherein, in the toughened and modified compound, the diisocyanate compound forms a polyimide bond with the styrene maleic anhydride compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace and the like.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile